Issue 40, 2024, Issue in Progress

Electrodeposition of Cu2NiSnS4 absorber layer on FTO substrate for solar cell applications

Abstract

Potentiostatic and in situ electrochemical impedance spectroscopy (EIS) measurements were recorded to study the nucleation and growth mechanisms of electrodeposited Cu2NiSnS4 (CNTS) thin films from aqueous solution at different applied potentials. The electrodeposition process of Cu–Ni–Sn–S precursors were studied using cyclic voltammetry and chronoamperometry techniques. The nucleation and growth mechanism of these films was found to follow a three-dimensional progressive nucleation limited by diffusion-controlled growth. The nucleation mechanism is found to be influenced by the presence of S2O32−, which prompts the electrodeposition of S. In situ electrochemical impedance spectroscopy (EIS) investigates the electrodeposition behavior of CNTS precursors on the surface electrode. A capacitive behavior was observed at high frequencies, while the presence of Warburg diffusion was detected only for potentials less negative than −1.0 V vs. Ag/AgCl. The crystallographic structure, morphology, composition, and optical band gap of CNTS thin films was examined using X-ray diffraction, Raman spectroscopy, scanning electron microscopy, and UV-visible spectroscopy. Electrodeposition at −0.98 V vs. Ag/AgCl resulted in the formation of microsheets with a uniform morphology and homogeneous thickness of sulfurized CNTS film. This potential also proved to be optimal for achieving higher crystallinity, a pure phase, and a suitable band gap energy of approximately 1.6 eV.

Graphical abstract: Electrodeposition of Cu2NiSnS4 absorber layer on FTO substrate for solar cell applications

Article information

Article type
Paper
Submitted
10 Jun 2024
Accepted
28 Aug 2024
First published
18 Sep 2024
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2024,14, 29439-29454

Electrodeposition of Cu2NiSnS4 absorber layer on FTO substrate for solar cell applications

O. Ait Layachi, H. Hrir, A. Boudouma, L. Atourki, S. Azmi, Y. Fariat, M. Nini, A. Moujib and E. M. Khoumri, RSC Adv., 2024, 14, 29439 DOI: 10.1039/D4RA04249B

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