Issue 1, 2024

Nanotechnology-driven wound healing potential of asiaticoside: a comprehensive review

Abstract

Asiaticoside (AC) is a naturally occurring phytoconstituent that aids in wound healing by stimulating collagen biosynthesis. However, the physical properties of AC, such as its high molecular weight (959.12 g mol−1), poor water solubility, and low permeability, restrict its therapeutic benefits. Additionally, the management of inflammation and angiogenesis in wound healing using AC-loaded wound dressings can be challenging in terms of its delivery across the skin layers. These challenges can be rectified by utilizing nanotechnology. The concept of nanotechnology is widely utilized in dermatology to boost the therapeutic efficacy of the entrapped drug. The AC-loaded nano-carriers deliver the drug at their target site in order to increase their efficacy, stability, and safety. These carriers efficiently distribute the loaded drug to the different skin layers. The current review focuses on the limitations associated with the topical administration of asiaticoside and the many initiatives made so far for effective and safe topical delivery using innovative constituents and techniques, along with other potential benefits of AC in wound healing, diabetes, inflammation, and depression.

Graphical abstract: Nanotechnology-driven wound healing potential of asiaticoside: a comprehensive review

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Article information

Article type
Review Article
Submitted
23 Oct 2023
Accepted
12 Feb 2024
First published
26 Feb 2024
This article is Open Access
Creative Commons BY license

RSC Pharm., 2024,1, 9-36

Nanotechnology-driven wound healing potential of asiaticoside: a comprehensive review

M. Kumar, D. Kumar, S. Mahmood, V. Singh, S. Chopra, A. R. Hilles and A. Bhatia, RSC Pharm., 2024, 1, 9 DOI: 10.1039/D3PM00024A

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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