A novel route to fabricate a superhydrophobic surface on a copper substrate without additional low surface energy materials†
Abstract
A novel route was adopted to fabricate a superhydrophobic surface on a copper substrate. A copper coating was electrodeposited from a choline chloride-based system and then heat treated at 150 °C in an air atmosphere. The treated sample showed rough surfaces and uneven grain sizes and exhibited a water contact angle (WCA) of 156.9°, showing a superhydrophobic performance. Compared with the copper alone, the superhydrophobic sample had a lower corrosion current and higher polarization resistance, indicating a better anti-corrosion behavior.