Issue 18, 2023

Dynamic behaviours of epoxy resin thin films during the curing process

Abstract

Epoxy resin thin films are widely used in applications such as coating materials, insulator films, and adhesives; accordingly, investigations of their physical properties have garnered increasing importance. Although the physical properties of thermoset epoxy thin films are strongly affected by the curing conditions, such as the heating temperature and curing time, the dynamic properties during the curing process have not been studied thoroughly. In this study, we investigated the thermal fluctuations on the surface of epoxy resin thin films using grazing-incidence X-ray photon correlation spectroscopy, to elucidate the dynamic behaviours during the curing process. We thus succeeded in observing the freezing of capillary waves during the thermal curing process. These results are expected to facilitate a deeper understanding of the curing mechanisms of various thin films.

Graphical abstract: Dynamic behaviours of epoxy resin thin films during the curing process

Supplementary files

Article information

Article type
Paper
Submitted
15 Nov 2022
Accepted
14 Apr 2023
First published
14 Apr 2023
This article is Open Access
Creative Commons BY license

Soft Matter, 2023,19, 3267-3272

Dynamic behaviours of epoxy resin thin films during the curing process

T. Hoshino, Y. Okamoto, A. Yamamoto and H. Masunaga, Soft Matter, 2023, 19, 3267 DOI: 10.1039/D2SM01500E

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements