Molecular engineering of a polyimide copolymer enables excellent dielectric and energy storage performance

Abstract

Polyimide dielectric materials with high discharge energy density (U_d) are of considerable interest for the microminiaturization and high integration of electronic devices. Herein, a novel polyimide copolymer (ZnTPP-PI) was synthesized through introducing a superconjugated zinc tetraphenylporphyrin unit into the molecular backbone based on the incorporation of molecular engineering and a copolymerization method, which achieves a simultaneous increase in breakdown strength (E_b) and dielectric permittivity (ε_r), resulting in a maximum U_d of 6.9 J cm⁻³.