Issue 24, 2022

Fabrication of highly conductive graphene/textile hybrid electrodes via hot pressing and their application as piezoresistive pressure sensors

Abstract

Textiles represent an ideal platform for next-generation electronic devices owing to their flexibility, stretchability, wearability, and biocompatibility. Herein, we present highly conductive and flexible electrodes based on electrochemically exfoliated graphene (EEG) and cotton textile; these electrodes are fabricated via hot pressing to be used as sensing materials in piezoresistive-type pressure sensors. The sheet resistance and microstructure of the electrodes can be controlled by varying the surface density of the EEG on the textile substrate. The optimized EEG/textile electrodes exhibited a minimum sheet resistance (Rs) of 1.3 Ω sq−1 as well as high flexibility and durability during a 1000-cycle bending test. The pressure sensors were fabricated by assembling two EEG/textile electrodes, with each electrode acting as a pressure-sensing material; the sensors exhibited a maximum pressure sensitivity of ∼0.16 kPa−1, a wide range of linear sensitivity (up to 100 kPa), a fast response of ∼373 ms, and reproducible performance over 10 000 cycles of pressure loading and unloading. These sensors also functioned effectively as bending-motion, wrist-pulse, and step-motion sensors, as well as on/off-type pressure sensors. Hence, the developed EEG/textile electrodes have the potential to be used in textile electronics and next-generation wearable devices.

Graphical abstract: Fabrication of highly conductive graphene/textile hybrid electrodes via hot pressing and their application as piezoresistive pressure sensors

Supplementary files

Article information

Article type
Paper
Submitted
11 Jan 2022
Accepted
27 May 2022
First published
31 May 2022

J. Mater. Chem. C, 2022,10, 9364-9376

Fabrication of highly conductive graphene/textile hybrid electrodes via hot pressing and their application as piezoresistive pressure sensors

Y. Kim, J. Bin Park, Y. J. Kwon, J. Hong, Y. Jeon and J. U. Lee, J. Mater. Chem. C, 2022, 10, 9364 DOI: 10.1039/D2TC00165A

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