Issue 26, 2022

A dual non-covalent bonding constructed continuous interfacial structure for reducing interfacial thermal resistance

Abstract

Polymer-based thermal conductive composites are essential to alleviating heat accumulation in electronic equipment. However, non-neglectable interface thermal resistance between fillers is unfavorable to their thermal conductivity, thus invalidating their applicability to electronic components. In this work, a low thermal resistance interface structure in adjacent graphene was constructed by functionalization of cationic poly(3-hexylthiophene) (C-P3HT) on an exfoliated graphene (E-G) surface. A “dual channel” for heat transfer between graphene layers was created through cation–π and π–π interactions between quaternary ammonium and the thiophene ring in both C-P3HT and E-G. The “dual channel” structures are assisted by C-P3HT with intrinsic thermal conductivity to form a continuous in-plane heat transfer pathway in composites. The advantage of E-G@C-P3HT/PVA results in a very high in-plane thermal conductivity up to 11.1 W m−1 K−1 along with good mechanical properties. The enhanced heat transfer effect of “dual channel” structures was further verified by molecular dynamics simulation analysis of phonon transport behavior at the interface of C-P3HT modified E-G. This study provides a new way to improve the thermal conductivity of composites by effectively reducing the interface thermal resistance.

Graphical abstract: A dual non-covalent bonding constructed continuous interfacial structure for reducing interfacial thermal resistance

Supplementary files

Article information

Article type
Paper
Submitted
02 Apr 2022
Accepted
31 May 2022
First published
01 Jun 2022

J. Mater. Chem. A, 2022,10, 13858-13867

A dual non-covalent bonding constructed continuous interfacial structure for reducing interfacial thermal resistance

B. Wu, Y. Li, W. Chen, B. Ding, P. Chen, R. Xia and J. Qian, J. Mater. Chem. A, 2022, 10, 13858 DOI: 10.1039/D2TA02651A

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