Issue 45, 2022

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Abstract

In consideration of low density and high intrinsic thermal conductivity, spherical graphite powders can act as promising fillers for light weight thermal interface materials. Herein, spherical artificial graphite derived composites exhibit a similar thermal conductivity and significantly reduced bulk density compared with traditional Al2O3-derived composites. Further, based on the particle packing theory, an innovatively optimized calculation method has been proposed by introducing the quadratic programming method into the traditional calculation method to acquire the optimum formulation of multi-scale spherical graphite particles. The thermal conductivity of the optimum formulation-derived composites attains 1.994 W m−1 K−1, which is 1.72 times higher than that of the single particle size-derived composites (1.156 W m−1 K−1), accompanied by a low density of 1.812 g cm−3 vs. the 2.31 g cm−3 of the traditional Al2O3-derived composites. Besides, the relationships between the tap density of the graphite powders, thermal conductivity and maximum filling content of the composites are creatively established, which are available for predicting the thermal conductivities of composites by simply testing the tap density of the fillers. This present work provides an instructional strategy to optimize spherical filler particles for thermal management of electronic devices.

Graphical abstract: Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Supplementary files

Article information

Article type
Paper
Submitted
25 Jul 2022
Accepted
07 Sep 2022
First published
13 Oct 2022
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2022,12, 29414-29422

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

D. Yan, Z. Li, N. Kong, M. Huang, Y. Tian, C. Ye, L. Fu, B. Wen, J. Liu, R. Tan and F. Han, RSC Adv., 2022, 12, 29414 DOI: 10.1039/D2RA04633D

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