Issue 6, 2022

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

Abstract

The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy to pay attention to the thermal contact resistance. Herein, we synthesized a polyurethane with hierarchical hydrogen bonding to realize high surface adhesion with substrates; another key was incorporating aluminum oxide modified by a deformable liquid metal to improve the thermo-conductive capability and offer the freedom of polymeric segmental motions. These molecular and structural designs endow the composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion, which enable low thermal resistance and durable thermal contact with substrates without the need for external pressure.

Graphical abstract: A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

Supplementary files

Article information

Article type
Communication
Submitted
03 Mar 2022
Accepted
22 Mar 2022
First published
22 Mar 2022

Mater. Horiz., 2022,9, 1690-1699

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

C. Guo, Y. Li, J. Xu, Q. Zhang, K. Wu and Q. Fu, Mater. Horiz., 2022, 9, 1690 DOI: 10.1039/D2MH00276K

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