Issue 41, 2022

Understanding the role of Cl doping in the oxygen evolution reaction on cuprous oxide by DFT

Abstract

Designing highly active and earth-abundant oxygen evolution reaction (OER) electrocatalysts for electrochemical water splitting remains a challenge. Recently, Cl-doped Cu2O has emerged as a very promising non-noble-metal electrocatalyst candidate for the OER. However, the mechanism of the OER catalyzed by Cl-doped Cu2O has not been explored systematically. Herein, a comprehensive density functional theory (DFT) study is employed to study the role of Cl doping via comparing the OER on pure and Cl-doped Cu2O surfaces with/without Cu vacancies. Our results reveal that Cl doping increases the adsorption ability of Cu2O(111) by providing an excess electron, while a Cu vacancy decreases its adsorption ability by changing the geometric structure of the adsorption sites and the electronic structures. Cl–Cu2O(111) (η = 0.58 V) and VCu–Cl–Cu2O(111) (η = 0.46 V) have comparable or even better OER activity than those of widely used OER electrocatalysts such as the IrO2 catalyst (η = 0.56 V). It is facile to have a Cu vacancy when Cu2O(111) is doped with Cl because of a large strain introduced by Cl doping. Thus, VCu–Cl–Cu2O(111) should be the most feasible catalyst for the OER catalyzed by Cl-doped Cu2O material. The dual role of Cl doping is that it not only increases the OER activity but also helps to form a Cu vacancy. The results show that Cu2O(111) activity can be greatly enhanced via electronic and geometric structure modulation, which is helpful for the design of more efficient Cu2O-based catalysis.

Graphical abstract: Understanding the role of Cl doping in the oxygen evolution reaction on cuprous oxide by DFT

Supplementary files

Article information

Article type
Paper
Submitted
13 Jun 2022
Accepted
26 Sep 2022
First published
27 Sep 2022

Phys. Chem. Chem. Phys., 2022,24, 25347-25355

Understanding the role of Cl doping in the oxygen evolution reaction on cuprous oxide by DFT

H. Chen, Y. Ji and T. Fan, Phys. Chem. Chem. Phys., 2022, 24, 25347 DOI: 10.1039/D2CP02671F

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