Issue 29, 2021

Dual synergistic effect of a carbon/metal hybrid network on the mechanical and electromagnetic interference shielding performance in self-assembly enhanced epoxy curing networks

Abstract

High performance ternary silver-coated tetra-needle-like ZnO whiskers (Ag@T-ZnO)/multi-walled carbon nanotubes (MWCNTs)/epoxy electromagnetic interference (EMI) shielding materials were prepared by a facile solvent assistant in situ polymerization (SAISP) procedure, which provides a unique deposited structure for these materials. Due to the fact that 3D Ag@T-ZnO particles are entangled by intertwined 1D MWCNTs, the incident EM wave can go through multiple interfacial reflection events in the heterogeneous interfaces between Ag@T-ZnO and intertwined MWCNTs, and 9 : 1 was determined as the appropriate mass ratio of Ag@T-ZnO and MWCNTs. The synergistic effect of the deposited carbon/metal conductive network structure and the synergy of the multidimensional hybrid fillers can provide remarkable EMI shielding effectiveness values of 86 dB and 88 dB for the EPBD-15 and EPBD-20 samples, which can still possess a high tensile strength of 72.4 MPa (compared to 56.3 MPa for the EPD-20 sample without BGE) and a Tg of 113.6 °C due to the synergistic effect of the deposited structure and the self-assembly effect of butyl glycidyl ether (BGE) soft chains in the epoxy curing network. The dual synergistic effect of carbon/metal hybrid fillers and the SAISP method can provide a new strategy for preparing structural EMI shielding composites that need high mechanical properties.

Graphical abstract: Dual synergistic effect of a carbon/metal hybrid network on the mechanical and electromagnetic interference shielding performance in self-assembly enhanced epoxy curing networks

Supplementary files

Article information

Article type
Paper
Submitted
18 Mar 2021
Accepted
28 May 2021
First published
29 May 2021

J. Mater. Chem. C, 2021,9, 9282-9291

Dual synergistic effect of a carbon/metal hybrid network on the mechanical and electromagnetic interference shielding performance in self-assembly enhanced epoxy curing networks

Q. Lian, W. Xu, H. Chen, Y. Li, H. Duan, Z. Wang, D. An, J. Cheng and Y. Liu, J. Mater. Chem. C, 2021, 9, 9282 DOI: 10.1039/D1TC01246K

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