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Issue 15, 2021
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Quantitative analysis of bending hysteresis by real-time monitoring of curvature in flexible polymeric films

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Abstract

Flexibility, viscoelasticity and stress–strain relation in bending polymeric films are key factors in designing mechanically durable flexible electronic devices and soft robots. However, bending hysteresis, which appears as a precursor phenomenon of fracture and fatigue, remains unclear; no one quantitatively evaluated a bending curvature causing hysteresis. Herein, we report the bending hysteresis of polymeric films used as common substrates in flexible electronics by precisely monitoring bending curvatures. By real-time measuring curvatures of films upon bending and subsequent unbending, we have successfully determined the curvatures that cause the hysteresis. These curvatures also depend on a film thickness. Furthermore, we revealed that the occurrence of bending hysteresis is explained by bending strains that have a nonlinear relation with internal stresses. This enables us to predict strain limits that cause the bending hysteresis, based on a stress–strain curve of polymeric films.

Graphical abstract: Quantitative analysis of bending hysteresis by real-time monitoring of curvature in flexible polymeric films

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Article information


Submitted
18 Dec 2020
Accepted
19 Mar 2021
First published
07 Apr 2021

Soft Matter, 2021,17, 4040-4046
Article type
Paper

Quantitative analysis of bending hysteresis by real-time monitoring of curvature in flexible polymeric films

R. Taguchi, K. Kuwahara, N. Akamatsu and A. Shishido, Soft Matter, 2021, 17, 4040
DOI: 10.1039/D0SM02233K

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