Issue 55, 2021, Issue in Progress
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RSC Advances

Study on curing kinetics and behaviours of PGN adhesives

Tengbo Li, ORCID logo a   Xiaomeng Li,*a   Shanjun Ding ORCID logo b  and  Yunjun Luo ORCID logo a  

* Corresponding authors

a School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
E-mail: 13651278705@139.com

b State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing, China

Abstract

The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.

Graphical abstract: Study on curing kinetics and behaviours of PGN adhesives

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Article information

DOI
https://doi.org/10.1039/D1RA04942A
Article type
Paper
Submitted
25 Jun 2021
Accepted
23 Sep 2021
First published
27 Oct 2021
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2021,11, 34836-34841

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Study on curing kinetics and behaviours of PGN adhesives

T. Li, X. Li, S. Ding and Y. Luo, RSC Adv., 2021, 11, 34836 DOI: 10.1039/D1RA04942A

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