Issue 4, 2021, Issue in Progress

Preparation of Ni micropillar arrays with high aspect ratios using anodic porous alumina template and their application to molds for imprinting

Abstract

Anodic porous alumina templates with controlled microscale geometrical structures were prepared by a process combining mask formation and subsequent selective etching of the alumina layer. In this process, the anisotropic etching of anodic porous alumina allows the preparation of anodic porous alumina with microhole array patterns having high aspect ratios. The electrodeposition of Ni using the obtained alumina templates generated an array of Ni micropillars with high aspect ratios. The height of Ni micropillars could also be controlled by adjusting the thickness of the anodic porous alumina. The obtained Ni micropillar array with a high aspect ratio was applied as a mold for imprinting. The ordered microstructures of TiO2 with high aspect ratios were prepared by imprinting using the Ni mold.

Graphical abstract: Preparation of Ni micropillar arrays with high aspect ratios using anodic porous alumina template and their application to molds for imprinting

Article information

Article type
Paper
Submitted
16 Nov 2020
Accepted
23 Dec 2020
First published
07 Jan 2021
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2021,11, 2096-2102

Preparation of Ni micropillar arrays with high aspect ratios using anodic porous alumina template and their application to molds for imprinting

T. Yanagishita, T. Hayakawa, T. Kondo and H. Masuda, RSC Adv., 2021, 11, 2096 DOI: 10.1039/D0RA09729B

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