Issue 8, 2021

Large plasmonic color metasurfaces fabricated by super resolution deep UV lithography

Abstract

In this paper, we demonstrate plasmonic color metasurfaces as large as ∼60 cm2 fabricated by deep UV projection lithography employing an innovative combination of resolution enhancement techniques. Briefly, in addition to the established off-axis dipole illumination, double- and cross-exposure resolution enhancement of lithography, we introduce a novel element, the inclusion of transparent assist features to the mask layout. With this approach, we demonstrate the fabrication of relief arrays having critical dimensions such as 159 nm nanopillars or 210 nm nanoholes with 300 nm pitches, which is near the theoretical resolution limit expressed by the Rayleigh criterion for the 248 nm lithography tool used in this work. The type of surface structure, i.e. nanopillar or nanohole, and their diameters can be tailored simply by changing the width of the assist features included in the mask layout. By coating the obtained nanopatterns with thin layers of either Au or Al, we observe color spectra originating from the phenomenon known as localized surface plasmon resonance (LSPR). We demonstrate the generation of color palettes representing a broad spectral range of colors, and we employ finite element modelling to corroborate the measured LSPR fingerprint spectra. Most importantly, the ∼60 cm2 nanostructure arrays can be written in only a few minutes, which is a tremendous improvement compared to the more established techniques employed for fabricating similar structures.

Graphical abstract: Large plasmonic color metasurfaces fabricated by super resolution deep UV lithography

Supplementary files

Article information

Article type
Paper
Submitted
07 Nov 2020
Accepted
18 Feb 2021
First published
18 Feb 2021
This article is Open Access
Creative Commons BY-NC license

Nanoscale Adv., 2021,3, 2236-2244

Large plasmonic color metasurfaces fabricated by super resolution deep UV lithography

M. Keil, A. E. Wetzel, K. Wu, E. Khomtchenko, J. Urbankova, A. Boisen, T. Rindzevicius, A. Bunea and R. J. Taboryski, Nanoscale Adv., 2021, 3, 2236 DOI: 10.1039/D0NA00934B

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