Issue 23, 2021

Effect of bulky 2,6-bis(spirocyclohexyl)-substituted piperidine rings in bis(hindered amino)trisulfide on thermal healability of polymethacrylate networks

Abstract

This paper describes the synthesis of highly sterically hindered piperidinyl trisulfide with four spirocyclohexyl moieties, bis(2,6-bis[spirocyclohexyl]piperidine-1-yl)trisulfide (BIBSCPS-S3), from commercially available starting materials in short steps and its application as a dynamic covalent bond for thermally healable polymer networks. Conformational study on the BIBSCPS-S3 moiety in the solid state is performed by single-crystal X-ray diffraction. In bulk, a stress-relaxation experiment reveals that the increase in steric hindrance can not only decrease the activation energy for thermal exchange reactions but also suppress chain-transfer reactions during radical polymerization to some extent. Therefore, the dynamic cross-linking point containing BIBSCPS-S3 moiety can be efficiently incorporated into polymer networks with ethyl, n-butyl, or n-hexyl methacrylate monomers, which is in good accordance with the relatively low chain-transfer constants of the BIBSCPS-S3 moiety determined by the Mayo equation. As a result, BIBSCPS-S3-cross-linked poly(n-hexyl methacrylate) exhibits nearly quantitative damage healability only by simple hot pressing at 90 °C under mild pressure for 24 h.

Graphical abstract: Effect of bulky 2,6-bis(spirocyclohexyl)-substituted piperidine rings in bis(hindered amino)trisulfide on thermal healability of polymethacrylate networks

Supplementary files

Article information

Article type
Paper
Submitted
06 Sep 2021
Accepted
25 Sep 2021
First published
28 Sep 2021
This article is Open Access
Creative Commons BY license

Mater. Adv., 2021,2, 7709-7714

Effect of bulky 2,6-bis(spirocyclohexyl)-substituted piperidine rings in bis(hindered amino)trisulfide on thermal healability of polymethacrylate networks

M. Aiba, T. Koizumi, K. Okamoto, M. Yamanaka, M. Futamura, Y. Ishigaki, M. Oda, C. Ooka, A. Takahashi and H. Otsuka, Mater. Adv., 2021, 2, 7709 DOI: 10.1039/D1MA00811K

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