Issue 43, 2020, Issue in Progress

A naringenin-based benzoxazine with an intramolecular hydrogen bond as both a thermal latent polymerization additive and property modifier for epoxy resins

Abstract

Epoxy resins are constantly attracting attention from industrial applications due to their excellent comprehensive properties. However, the traditional curing agents for liquid epoxy resins react with epoxides even at room temperature, which causes difficulties in processing since such mixtures cannot be directly used as single-component materials. In order to improve the shelf life of the mixtures, we have designed an intramolecular hydrogen bond-containing benzoxazine monomer as a smart thermal latent polymerization agent for epoxy resins. The newly obtained benzoxazine, NAR-a, has been synthesized from the Mannich condensation of naringenin, aniline and paraformaldehyde. In addition to playing the role of a curing agent, NAR-a has also performed as an excellent property modifier for epoxy thermosetting systems. The resulting thermoset based on the NAR-a/epoxy thermosetting system exhibits high thermal stability and good intrinsic flame retardance, with a Tg temperature of 201 °C, a Td5 temperature of 349 °C, a low CET value (32.4 ppm per °C) and low heat release capacity (HRC of 159.1 J g−1 K−1). The combined long-term storage stability and versatility of the intramolecular hydrogen bond-containing benzoxazine/epoxy system provide a new strategy for the development of one-component epoxy-related thermosetting resins for application in high-performance areas.

Graphical abstract: A naringenin-based benzoxazine with an intramolecular hydrogen bond as both a thermal latent polymerization additive and property modifier for epoxy resins

Supplementary files

Article information

Article type
Paper
Submitted
22 May 2020
Accepted
22 Jun 2020
First published
07 Jul 2020
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2020,10, 25629-25638

A naringenin-based benzoxazine with an intramolecular hydrogen bond as both a thermal latent polymerization additive and property modifier for epoxy resins

B. Hao, R. Yang and K. Zhang, RSC Adv., 2020, 10, 25629 DOI: 10.1039/D0RA04702C

This article is licensed under a Creative Commons Attribution-NonCommercial 3.0 Unported Licence. You can use material from this article in other publications, without requesting further permission from the RSC, provided that the correct acknowledgement is given and it is not used for commercial purposes.

To request permission to reproduce material from this article in a commercial publication, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party commercial publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements