Issue 17, 2020

Highly-robust, solution-processed flexible transparent electrodes with a junction-free electrospun nanofiber network

Abstract

Flexible transparent electrodes (FTEs) are widely used in a variety of applications, including flexible displays and wearable devices. Important factors in FTE design include active control of electrical sheet resistance, optical transparency and mechanical flexibility. Because these factors are inversely proportional to one another, it is essential to develop a technique that maintains flexibility while actively controlling the sheet resistance and transparency for a variety of applications. This research presents a new method for fabricating transparent electrodes on flexible polyimide films using electrospinning and copper electroless deposition methods. A flat metal network-based electrode without contact resistance was fabricated by heat treatment and electroless deposition onto the electrospun seed layer. The fabricated FTEs exhibited a transparency exceeding 80% over the entire visible light range and a sheet resistance of less than 10.0 Ω sq−1. Due to the heat treatment process, the adhesion between the metal network and the substrate was superior to other electrospinning-based transparent electrodes. Applicable to the large-area manufacturing process, the standard deviation of the network density of the fabricated large-area FTE was about 1%. This study does not require the polymer casting technique and has further advantages for mass production of electrodes and application to various fields.

Graphical abstract: Highly-robust, solution-processed flexible transparent electrodes with a junction-free electrospun nanofiber network

Supplementary files

Article information

Article type
Paper
Submitted
07 Dec 2019
Accepted
01 Mar 2020
First published
09 Mar 2020
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2020,10, 9940-9948

Highly-robust, solution-processed flexible transparent electrodes with a junction-free electrospun nanofiber network

G. H. Kim, H. Woo, S. Kim, T. An and G. Lim, RSC Adv., 2020, 10, 9940 DOI: 10.1039/C9RA10278G

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