Issue 62, 2019

Effect of Fe ion implantation on the thermoelectric properties and electronic structures of CoSb3 thin films

Abstract

In the present study, thin films of single-phase CoSb3 were deposited onto Si(100) substrates via pulsed laser deposition (PLD) method using a polycrystalline target of CoSb3. These films were implanted by 120 keV Fe-ions with three different fluences: 1 × 1015, 2.5 × 1015 and 5 × 1015 ions per cm2. All films were characterised by X-ray diffraction (XRD), Raman spectroscopy, atomic force microscopy (AFM), Rutherford backscattering (RBS) spectrometry and X-ray absorption spectroscopy (XAS). XRD data revealed that the ion implantation decreased the crystalline nature of these films, which are recovered after the rapid thermal annealing process. The Seebeck coefficient S vary with the fluences in the temperature range of 300 K to 420 K, and is found to be highest (i.e., 254 μV K−1) at 420 K for the film implanted with 1 × 1015 ions per cm2. The high S and low resistivity lead to the highest power factor for the film implanted with 1 × 1015 ions per cm2 (i.e., 700 μW m−1 K−2) at 420 K. The changing of the sign of S from negative for the pristine film to positive for the Fe-implanted samples confirm that the Fe ions are electrically active and act as electron acceptors by replacing the Co atoms. XAS measurements confirm that the Fe ions occupied the Co site in the cubic frame of the skutterudite and exist in the 3+ oxidation state in this structure.

Graphical abstract: Effect of Fe ion implantation on the thermoelectric properties and electronic structures of CoSb3 thin films

Article information

Article type
Paper
Submitted
29 Aug 2019
Accepted
14 Oct 2019
First published
06 Nov 2019
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2019,9, 36113-36122

Effect of Fe ion implantation on the thermoelectric properties and electronic structures of CoSb3 thin films

A. Masarrat, A. Bhogra, R. Meena, M. Bala, R. Singh, V. Barwal, C. Dong, C. Chen, T. Som, A. Kumar, A. Niazi and K. Asokan, RSC Adv., 2019, 9, 36113 DOI: 10.1039/C9RA06873B

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