Issue 19, 2019, Issue in Progress

One-step ultra-rapid fabrication and thermoelectric properties of Cu2Se bulk thermoelectric material

Abstract

Cu2Se is a promising material for high temperature thermoelectric energy conversion due to its unique combination of excellent electronic properties and low thermal conductivity owing to its ionic liquid characteristics at high temperature. In this paper, fully dense single-phase bulk Cu2Se material was prepared by the combination of self-propagating high-temperature synthesis (SHS) with in situ quick pressing (QP) for the first time. This new approach shortens the duration of the synthesis from days to hours compared to conventional preparation methods. SHS-QP technique is an ultra-fast preparation method, which utilizes the heat released by the SHS reaction and an external applied pressure to achieve the synthesis and densification of materials in one-step. The ultra-fast process of the SHS-QP technique enables the fabrication of single-phase Cu2Se bulk materials with relative density of over 98% and with precise control over the stoichiometry owing to the ability to suppress the Se vapor during the reaction. The SHS-QP prepared Cu2Se samples exhibit excellent thermoelectric figure of merit, ZT ∼ 1.5 at 900 K, which is comparable to those of Cu2Se materials prepared by conventional methods. This study opens a new avenue for the ultra-fast and low-cost fabrication of Cu2Se thermoelectric materials.

Graphical abstract: One-step ultra-rapid fabrication and thermoelectric properties of Cu2Se bulk thermoelectric material

Article information

Article type
Paper
Submitted
07 Feb 2019
Accepted
25 Mar 2019
First published
04 Apr 2019
This article is Open Access
Creative Commons BY license

RSC Adv., 2019,9, 10508-10519

One-step ultra-rapid fabrication and thermoelectric properties of Cu2Se bulk thermoelectric material

T. Hu, Y. Yan, S. Wang, X. Su, W. Liu, G. Tan, P. Poudeu-Poudeu and X. Tang, RSC Adv., 2019, 9, 10508 DOI: 10.1039/C9RA01008D

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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