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Issue 3, 2019, Issue in Progress
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Ultrathin flexible graphene films with high thermal conductivity and excellent EMI shielding performance using large-sized graphene oxide flakes

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Abstract

As the demand for wearable and foldable electronic devices increases rapidly, ultrathin and flexible thermal conducting films with exceptional electromagnetic interference (EMI) shielding effectiveness (SE) are greatly needed. Large-sized graphene oxide flakes and thermal treatment were employed to fabricate lightweight, flexible and highly conductive graphene films. Compared to graphene films made of smaller-sized flakes, the graphene film made of large-sized flakes possesses less defects and more conjugated domains, leading to higher electrical and higher thermal conductivities, as well as higher EMI SE. By compressing four-layer porous graphene films together, a 14 μm-thick graphene film (LG-4) was obtained, possessing EMI SE of 73.7 dB and the specific SE divided by thickness (SSE/t) of 25 680 dB cm2 g−1. The ultrahigh EMI shielding property of the LG-4 film originates from the excellent electrical conductivity (6740 S cm−1), as well as multi-layer structure composed of graphene laminates and insulated air pores. Moreover, the LG-4 film shows excellent flexibility and high thermal conductivity (803.1 W m−1 K−1), indicating that the film is a promising candidate for lightweight, flexible thermal conducting film with exceptional EMI shielding performance.

Graphical abstract: Ultrathin flexible graphene films with high thermal conductivity and excellent EMI shielding performance using large-sized graphene oxide flakes

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Publication details

The article was received on 14 Nov 2018, accepted on 27 Dec 2018 and first published on 11 Jan 2019


Article type: Paper
DOI: 10.1039/C8RA09376H
Citation: RSC Adv., 2019,9, 1419-1427
  • Open access: Creative Commons BY license
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    Ultrathin flexible graphene films with high thermal conductivity and excellent EMI shielding performance using large-sized graphene oxide flakes

    S. Lin, S. Ju, J. Zhang, G. Shi, Y. He and D. Jiang, RSC Adv., 2019, 9, 1419
    DOI: 10.1039/C8RA09376H

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