Issue 4, 2019

Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Abstract

Correction for ‘Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics’ by Chandramouli Subramaniam and Kenji Hata et al., Nanoscale, 2014, 6, 2669–2674.

Associated articles

Article information

Article type
Correction
Submitted
07 Jan 2019
Accepted
07 Jan 2019
First published
15 Jan 2019
This article is Open Access
Creative Commons BY license

Nanoscale, 2019,11, 2089-2089

Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

C. Subramaniam, Y. Yasuda, S. Takeya, S. Ata, A. Nishizawa, D. Futaba, T. Yamada and K. Hata, Nanoscale, 2019, 11, 2089 DOI: 10.1039/C9NR90011J

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements