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Issue 12, 2019
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High performing AgNW transparent conducting electrodes with a sheet resistance of 2.5 Ω Sq−1 based upon a roll-to-roll compatible post-processing technique

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Abstract

A report of transparent and conducting silver nanowires (AgNWs) that produce remarkable electrical performance, surface planarity and environmental stability is given. This research presents an innovative process that relies on three sequential steps, which are roll-to-roll (R2R) compatible: thermal embossing, infrared sintering and plasma treatment. This process leads to the demonstration of a conductive film with a sheet resistance of 2.5 Ω sq−1 and high transmittance, thus demonstrating the highest reported figure-of-merit in AgNWs to date (FoM = 933). A further benefit of the process is that the surface roughness is substantially reduced compared to traditional AgNW processing techniques. The consideration of the long-term stability is given by developing an accelerated life test process that simultaneously stresses the applied bias and temperature. Regression line fitting shows that a ∼150-times improvement in stability is achieved under ‘normal operational conditions’ when compared to traditionally deposited AgNW films. X-ray photoelectron spectroscopy (XPS) is used to understand the root cause of the improvement in long-term stability, which is related to reduced chemical changes in the AgNWs.

Graphical abstract: High performing AgNW transparent conducting electrodes with a sheet resistance of 2.5 Ω Sq−1 based upon a roll-to-roll compatible post-processing technique

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Publication details

The article was received on 30 Sep 2018, accepted on 17 Jan 2019 and first published on 12 Feb 2019


Article type: Paper
DOI: 10.1039/C8NR07974A
Nanoscale, 2019,11, 5760-5769
  • Open access: Creative Commons BY license
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    High performing AgNW transparent conducting electrodes with a sheet resistance of 2.5 Ω Sq−1 based upon a roll-to-roll compatible post-processing technique

    D. Kumar, V. Stoichkov, E. Brousseau, G. C. Smith and J. Kettle, Nanoscale, 2019, 11, 5760
    DOI: 10.1039/C8NR07974A

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