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Issue 29, 2018
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Copper molybdenum sulfide anchored nickel foam: a high performance, binder-free, negative electrode for supercapacitors

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Abstract

Herein, we are demonstrating the use of a binder-free electrode based on copper–molybdenum–sulfide nanostructures grown on nickel foam (CMS/Ni) as a novel negative electrode for supercapacitors. The cyclic voltammetry and charge–discharge analyses reveal the pseudocapacitive nature of the CMS/Ni electrode with a high specific capacity of 633 mAh g−1 (∼20-fold higher than the binder-based CMS electrode) which is mainly due to their superior electronic conductivity and short ion transport pathways. Furthermore, the fabricated symmetric supercapacitor using the CMS/Ni electrode delivered a high device capacitance (265.62 F g−1), high energy density (23.61 Wh kg−1) and long cycle-life. The results ensure that the CMS/Ni binder-free electrode will be a promising negative electrode for high-performance supercapacitors.

Graphical abstract: Copper molybdenum sulfide anchored nickel foam: a high performance, binder-free, negative electrode for supercapacitors

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Publication details

The article was received on 17 May 2018, accepted on 22 Jun 2018 and first published on 22 Jun 2018


Article type: Communication
DOI: 10.1039/C8NR03998D
Citation: Nanoscale, 2018,10, 13883-13888
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    Copper molybdenum sulfide anchored nickel foam: a high performance, binder-free, negative electrode for supercapacitors

    S. Sahoo, K. Krishnamoorthy, P. Pazhamalai and S. -. Kim, Nanoscale, 2018, 10, 13883
    DOI: 10.1039/C8NR03998D

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