Jump to main content
Jump to site search

Issue 34, 2017
Previous Article Next Article

Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Author affiliations

Abstract

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

Graphical abstract: Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Back to tab navigation

Supplementary files

Article information


Submitted
17 Apr 2017
Accepted
10 Aug 2017
First published
10 Aug 2017

J. Mater. Chem. C, 2017,5, 8707-8713
Article type
Communication

Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

X. Zhang, X. Zheng, H. Zhang, J. Zhang, J. Fu, Q. Zhang, C. Peng, F. Bai, X. Zhang and Y. Peng, J. Mater. Chem. C, 2017, 5, 8707
DOI: 10.1039/C7TC01668A

Social activity

Search articles by author

Spotlight

Advertisements