Pyridine–copper(ii) formates for the generation of high conductivity copper films at low temperatures†
Abstract
Pyridine derivatives coordinated to copper(II) formates are shown to have lower decomposition temperatures than the alkylamine analogues. Using heating profiles compatible with low temperature substrates, deposited inks made from these compounds are transformed into copper traces with a resistivity value of 14 μΩ cm when sintered at 135 °C in <5 minutes.