Issue 75, 2015

Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

Abstract

A conductive paste was prepared with submicrometer-sized copper fine particles that were coated by a gelatin nanoskin. The average particle size was ca. 130 nm. After drying, an oxidation–reduction two-step sintering process was proposed for these submicrometer-sized copper fine particles to obtain low-resistivity layers at a very low temperature. The optimized conditions gave a low resistivity of 8.2 × 10−6 Ω cm, even when the particles were covered by a common polymer. Our results suggest that the formation of the small copper oxide prominences on the surface of the copper fine particles could be reduced at low temperatures, forming connected submicrometer-sized metallic copper particles.

Graphical abstract: Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

Supplementary files

Article information

Article type
Paper
Submitted
13 Apr 2015
Accepted
06 Jul 2015
First published
07 Jul 2015
This article is Open Access
Creative Commons BY license

RSC Adv., 2015,5, 61290-61297

Author version available

Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

T. Yonezawa, H. Tsukamoto and M. Matsubara, RSC Adv., 2015, 5, 61290 DOI: 10.1039/C5RA06599B

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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