Jump to main content
Jump to site search
PLANNED MAINTENANCE Close the message box

Scheduled maintenance work on Wednesday 21st October 2020 from 07:00 AM to 07:00 PM (BST).

During this time our website performance may be temporarily affected. We apologise for any inconvenience this might cause and thank you for your patience.


Issue 43, 2014
Previous Article Next Article

Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide

Author affiliations

Abstract

The metal–organic Cu(I) complex 1,3-diisopropyl-imidazolin-2-ylidene copper hexamethyl disilazide has been tested as a novel oxygen-free precursor for atomic layer deposition of Cu with molecular hydrogen. Being a strong Lewis base, the carbene stabilizes the metal centre to form a monomeric compound that can be vaporised and transported without visible degradation. A significant substrate dependence of the growth process not only with respect to the film material but also to the structure of the films was observed. On Pd surfaces continuous films are grown and no phase boundary can be observed between the Cu film and the Pd, while island growth is observed on Ru substrates, which as a consequence requires thicker films in order to achieve a fully coalesced layer. Island growth is also observed for ultra-thin (<10 nm) Pd layers on Si substrates. Possible explanations for the different growth modes observed are discussed.

Graphical abstract: Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide

Back to tab navigation

Article information


Submitted
02 Jul 2014
Accepted
23 Sep 2014
First published
23 Sep 2014

J. Mater. Chem. C, 2014,2, 9205-9214
Article type
Paper
Author version available

Atomic layer deposition of Cu with a carbene-stabilized Cu(I) silylamide

D. J. Hagen, I. M. Povey, S. Rushworth, J. S. Wrench, L. Keeney, M. Schmidt, N. Petkov, S. T. Barry, J. P. Coyle and M. E. Pemble, J. Mater. Chem. C, 2014, 2, 9205
DOI: 10.1039/C4TC01418A

Social activity

Search articles by author

Spotlight

Advertisements