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Issue 48, 2014
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Flexible, in-plane, and all-solid-state micro-supercapacitors based on printed interdigital Au/polyaniline network hybrid electrodes on a chip

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Abstract

A simple and rapid fabrication method involving laser printing technology and in situ anodic electropolymerization is introduced to fabricate interdigital Au/polyaniline network hybrid electrodes on polyethylene terephthalate films for flexible, in-plane, and all-solid-state micro-supercapacitors. The as-obtained micro-supercapacitors acquire a maximum energy density of 5.83 mW h cm−3 and a maximum power density of 0.45 W cm−3 that are both comparable to or superior to the values obtained for currently available state-of-the-art planar supercapacitors/micro-supercapacitors. In addition, the micro-supercapacitors exhibit remarkably high mechanical flexibility and show a good cycling stability, with 72.7% retention of the specific capacity after 1000 cycles. Moreover, the micro-supercapacitors can be optionally connected in series or in parallel to meet the voltage and capacity requirements for a given application. Compared to traditional fabrication approaches for flexible micro-supercapacitors with an interdigital in-plane design, the method demonstrated here does not involve a complicated lithography process, toxic chemical treatments, expensive rigid template, and cumbersome fabrication of jettable and stable precursor ink, which provides a simple route for fabrication of flexible planar micro-supercapacitors with high-practicality and high-performance.

Graphical abstract: Flexible, in-plane, and all-solid-state micro-supercapacitors based on printed interdigital Au/polyaniline network hybrid electrodes on a chip

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Supplementary files

Article information


Submitted
08 Oct 2014
Accepted
31 Oct 2014
First published
31 Oct 2014

J. Mater. Chem. A, 2014,2, 20916-20922
Article type
Paper
Author version available

Flexible, in-plane, and all-solid-state micro-supercapacitors based on printed interdigital Au/polyaniline network hybrid electrodes on a chip

H. Hu, K. Zhang, S. Li, S. Ji and C. Ye, J. Mater. Chem. A, 2014, 2, 20916
DOI: 10.1039/C4TA05345A

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