Issue 8, 2014

Electrodeposited 3D porous silicon/copper films with excellent stability and high rate performance for lithium-ion batteries

Abstract

We report a simple two-step fabrication process of 3D porous Si/copper films by an electrodeposition method using a hydrogen gas bubble template. A 3D porous Si/copper film provides a large surface area, a highly conductive pathway, a short ion diffusion length, and buffer spaces to accommodate the stress during the cycling processes.

Graphical abstract: Electrodeposited 3D porous silicon/copper films with excellent stability and high rate performance for lithium-ion batteries

Supplementary files

Article information

Article type
Communication
Submitted
12 Nov 2013
Accepted
18 Dec 2013
First published
18 Dec 2013

J. Mater. Chem. A, 2014,2, 2478-2481

Electrodeposited 3D porous silicon/copper films with excellent stability and high rate performance for lithium-ion batteries

J. Suk, D. Y. Kim, D. W. Kim and Y. Kang, J. Mater. Chem. A, 2014, 2, 2478 DOI: 10.1039/C3TA14645F

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