Issue 24, 2014

Chemical vapour deposition of epitaxial rhombohedral BN thin films on SiC substrates

Abstract

Epitaxial growth of rhombohedral boron nitride (r-BN) on different polytypes of silicon carbide (SiC) is demonstrated using thermally activated hot-wall chemical vapour deposition and triethyl boron and ammonia as precursors. With respect to the crystalline quality of the r-BN films, we investigate the influence of the deposition temperature, the precursor ratio (N/B) and the addition of a minute amount of silicon to the gas mixture. From X-ray diffraction and transmission electron microscopy, we find that the optimal growth temperature for epitaxial r-BN on the Si-face of the SiC substrates is 1500 °C at a N/B ratio of 642 and silicon needs to be present not only in the gas mixture during deposition but also on the substrate surface. Such conditions result in the growth of films with a c-axis identical to that of the bulk material and a thickness of 200 nm, which is promising for the development of BN films for electronic applications.

Graphical abstract: Chemical vapour deposition of epitaxial rhombohedral BN thin films on SiC substrates

Article information

Article type
Paper
Submitted
20 Feb 2014
Accepted
03 Apr 2014
First published
04 Apr 2014
This article is Open Access
Creative Commons BY license

CrystEngComm, 2014,16, 5430-5436

Author version available

Chemical vapour deposition of epitaxial rhombohedral BN thin films on SiC substrates

M. Chubarov, H. Pedersen, H. Högberg, Zs. Czigany and A. Henry, CrystEngComm, 2014, 16, 5430 DOI: 10.1039/C4CE00381K

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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