Issue 43, 2013

Gate field induced ordered electric dipoles in a polymer dielectric for low-voltage operating organic thin-film transistors

Abstract

The development of low voltage-operating organic thin-film transistors requires high-dielectric constant (high-K) materials for the device's gate dielectrics. The surface properties of these high-K materials must match those of organic semiconductors. A modification material coated on high-K dielectric is needed, and polyimide (PI) is a promising modifier to reduce the surface energy and the interface trap states (in the level of 1010 cm−2 eV−1) of the high-K dielectrics. In this study, surface characteristics of the dielectrics were identified and interface analyses at the dielectric/organic semiconductor interface were conducted through combined electrical force microscopy and impedance–admittance investigation. When the organic semiconductor pentacene was grown on the PI-modified dielectrics, the atomic force microscopy images and X-ray diffraction analyses showed larger grain size and higher crystallinity than those on native high-K dielectrics. Using polyimide-modified high-K materials as the gate dielectric, high performances (SS < 1 V per decade, μ above 0.1 cm2 V−1 s−1, and on/off ratio > 105) and low voltage-operating (<5 V) pentacene-based thin-film transistors were achieved. Although the gate field was decreased by inserting a PI layer, the effective gate field was compensated by an electric dipole-induced dipole field embedded in the PI layer. The mechanism of carrier accumulation at the PI/pentacene interface was also clearly described.

Graphical abstract: Gate field induced ordered electric dipoles in a polymer dielectric for low-voltage operating organic thin-film transistors

Article information

Article type
Paper
Submitted
05 Jun 2013
Accepted
21 Aug 2013
First published
21 Aug 2013

RSC Adv., 2013,3, 20267-20272

Gate field induced ordered electric dipoles in a polymer dielectric for low-voltage operating organic thin-film transistors

W. Chou, T. Ho, H. Cheng, F. Tang, J. H. Chen and Y. Wang, RSC Adv., 2013, 3, 20267 DOI: 10.1039/C3RA42765J

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