Hot embossing and thermoforming of biodegradable three-dimensional wood structures
Abstract
Hot embossing allows for low cost fabrication of
* Corresponding authors
a
Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), H.-v.-Helmholtz Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
E-mail:
matthias.worgull@kit.edu, hendrik.hoelscher@kit.edu
b Institute of Photonics and Quantum Electronics, Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe, Germany
Hot embossing allows for low cost fabrication of
M. Worgull, M. Schneider, M. Röhrig, T. Meier, M. Heilig, A. Kolew, K. Feit, H. Hölscher and J. Leuthold, RSC Adv., 2013, 3, 20060 DOI: 10.1039/C3RA42642D
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