Nucleation of copper on mild steel in copper chloride (CuCl2·2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol (EG) ionic liquid

Abstract

A dense and adhesive Cu layer was successfully electrodeposited on mild steel in a copper chloride (CuCl₂·2H₂O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol [EG] ionic liquid. The mechanism of copper nucleation is studied using cyclic voltammetry and chronoamperometry. It is observed that 3D-instantaneous nucleation leads to a bright nano-structured deposit. The morphology of the deposit was characterized SEM and X-ray diffraction techniques. The deposition method was found to take place in an environmentally friendly green electrolyte without co-ligands such as cyanide and volatile toxic solvents.