Issue 6, 2013
From the journal:

Lab on a Chip

Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment†

Yan Xu,*a   Chenxi Wang,bc   Lixiao Li,b   Nobuhiro Matsumoto,a   Kihoon Jang,b   Yiyang Dong,bd   Kazuma Mawatari,b   Tadatomo Sugac  and  Takehiko Kitamori*b  

* Corresponding authors

a Nanoscience and Nanotechnology Research Center, Research Organization for the 21st Century, Osaka Prefecture University, 1-2, Gakuen-cho, Naka-ku, Sakai, Osaka 599-8570, Japan
E-mail: y-xu@21c.osakafu-u.ac.jp
Fax: +81-72-254-7813
Tel: +81-72-254-7813

b Department of Applied Chemistry, School of Engineering, The University of Tokyo, 7-3-1, Hongo, Bunkyo, Tokyo, Japan
E-mail: kitamori@icl.t.u-tokyo.ac.jp
Fax: +81-3-5841-6039
Tel: +81-3-5841-7231

c Department of Precision Engineering, School of Engineering, The University of Tokyo, 7-3-1, Hongo, Bunkyo, Tokyo, Japan

d College of Life Science and Technology, Beijing University of Chemical Technology, 15 Beisanhuan East Road, Chaoyang District, Beijing 100129, China

Abstract

A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (∼1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ∼25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O2/CF4 gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.

Graphical abstract: Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

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Article information

DOI
https://doi.org/10.1039/C3LC41345D
Article type
Technical Innovation
Submitted
07 Dec 2012
Accepted
08 Jan 2013
First published
09 Jan 2013

Lab Chip, 2013,13, 1048-1052

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Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

Y. Xu, C. Wang, L. Li, N. Matsumoto, K. Jang, Y. Dong, K. Mawatari, T. Suga and T. Kitamori, Lab Chip, 2013, 13, 1048 DOI: 10.1039/C3LC41345D

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