Issue 14, 2013

Metallopolymer formation using the (1R,2R)-N,N′-bis(pyridylmethylene)cyclohexane-1,2-diamine (BPID) ligand class

Abstract

The BPID ligand class is exploited as a scaffold for polymeric materials. Reaction of excess K or KH with the 2-pyridyl-BPID ligand results in the formation of a novel THF-bridged 1-D metallopolymer while the analogous reaction with the 4-pyridyl derivative results in a pyridyl-bridged 2-D metallopolymer.

Graphical abstract: Metallopolymer formation using the (1R,2R)-N,N′-bis(pyridylmethylene)cyclohexane-1,2-diamine (BPID) ligand class

Supplementary files

Article information

Article type
Communication
Submitted
31 Jan 2013
Accepted
04 Feb 2013
First published
21 Feb 2013

Dalton Trans., 2013,42, 4768-4771

Metallopolymer formation using the (1R,2R)-N,N′-bis(pyridylmethylene)cyclohexane-1,2-diamine (BPID) ligand class

K. V. Vasudevan, N. C. Smythe, B. L. Scott and J. C. Gordon, Dalton Trans., 2013, 42, 4768 DOI: 10.1039/C3DT50327E

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