Patterning of electrodes for mechanically robust and bendable lithium-ion batteries

Abstract

We demonstrate a simple route for fabricating trench-type copper patterns by combining a photo-lithography with a wet etching process. Nanostructured CuO was grown on the patterned Cu current collectors via a simple solution immersion process. And silicon nanoparticles were filled into the patterned Cu current collectors. The strongly immobilized CuO on the patterned Cu exhibited high electrochemical performance, including a high reversible capacity and a high rate capability.