Issue 38, 2012

Low temperature-cured electrically conductive pastes for interconnection on electronic devices

Abstract

Highly conductive pastes were prepared by thermal sintering of silver particles into a polymer matrix. These electrically conductive pastes are composed of a novolac epoxy resin and a trimodal metallic mixture of micron-sized silver flakes, silver microspheres, and silver nanoparticles and can be cured at relatively low temperatures. Our strategy is to cure the epoxy resins at a higher temperature than the sintering temperature of the silver powders to form a good metallic network of the conductive materials. We found that our epoxy-based conducting pastes had a low volume resistivity and high electrical conductivity of 8.9 × 10−6 Ω cm and 1.1 × 105 S cm−1, respectively, even at a low curing temperature of 250 °C. The resulting high conductivity may be attractive for numerous applications in various optoelectronic devices that require low-temperature processing.

Graphical abstract: Low temperature-cured electrically conductive pastes for interconnection on electronic devices

Supplementary files

Article information

Article type
Paper
Submitted
18 May 2012
Accepted
13 Aug 2012
First published
13 Aug 2012

J. Mater. Chem., 2012,22, 20529-20534

Low temperature-cured electrically conductive pastes for interconnection on electronic devices

H. S. Lim, S. Kim, J. A. Lim and S. Park, J. Mater. Chem., 2012, 22, 20529 DOI: 10.1039/C2JM33168C

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