Flexible microfluidic devices with three-dimensional interconnected microporous walls for gas and liquid applications†
Abstract
This article presents a simple, low-cost method of fabrication and the applications of flexible
* Corresponding authors
a
Science & Technology, Corning Incorporated, Corning, New York, USA
E-mail:
yuenp@corning.com
Fax: +1 (607) 974-5957
Tel: +1 (607) 974-9680
This article presents a simple, low-cost method of fabrication and the applications of flexible
P. K. Yuen and M. E. DeRosa, Lab Chip, 2011, 11, 3249 DOI: 10.1039/C1LC20157C
To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.
If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.
If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.
Read more about how to correctly acknowledge RSC content.
Fetching data from CrossRef.
This may take some time to load.
Loading related content