Composition, structure, bonding and thermoelectric properties of “CuT2P3” and “CuT4P3”, members of the T1−x(CuP3)x series with T being Si and Ge†
Abstract
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- This article is part of the themed collection: Thermoelectric materials
* Corresponding authors
a
Department of Chemistry, McMaster University, 1280 Main Street West, Hamilton, Ontario, Canada
E-mail:
mozhar@mcmaster.ca
b National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki, Japan
c Ames Laboratory, Iowa State University, Ames, Iowa, USA
d Canadian Neutron Beam Centre, NRC, Chalk River, Ontario, Canada
Through
P. Wang, F. Ahmadpour, T. Kolodiazhnyi, A. Kracher, L. M. D. Cranswick and Y. Mozharivskyj, Dalton Trans., 2010, 39, 1105 DOI: 10.1039/B914555A
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