Issue 48, 2007

Study of a novel ALD process for depositing MgF2 thin films

Abstract

Magnesium fluoride is an ultraviolet (UV) transparent material which is widely used in optical applications over a wide wavelength range. We have developed a novel atomic layer deposition (ALD) process for depositing magnesium fluoride thin films for the first time. MgF2 films were grown at 250–400 °C using Mg(thd)2 and TiF4 as precursors. The crystallinity, morphology, composition, thicknesses and refractive indices of the films were analyzed by X-ray diffraction/reflection (XRD/XRR), transmission electron microscopy (TEM), atomic force microscopy (AFM), field emission scanning electron microscopy (FESEM), time-of-flight elastic recoil detection analysis (TOF-ERDA), and UV-vis spectrophotometry. Electrical properties were also measured. The growth rate was temperature dependent decreasing from 1.6 Å cycle−1 at 250 °C to 0.7 Å cycle−1 at 400 °C. The films were polycrystalline at 250–400 °C. The refractive indices were between 1.34–1.42 and the permittivity 4.9. The impurity levels were below 0.6 at.% in the films deposited at 350–400 °C.

Graphical abstract: Study of a novel ALD process for depositing MgF2 thin films

Article information

Article type
Paper
Submitted
16 Jul 2007
Accepted
19 Oct 2007
First published
31 Oct 2007

J. Mater. Chem., 2007,17, 5077-5083

Study of a novel ALD process for depositing MgF2 thin films

T. Pilvi, T. Hatanpää, E. Puukilainen, K. Arstila, M. Bischoff, U. Kaiser, N. Kaiser, M. Leskelä and M. Ritala, J. Mater. Chem., 2007, 17, 5077 DOI: 10.1039/B710903B

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