Issue 7, 2006
From the journal:

Lab on a Chip

High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

Neil S. Cameron,*a   Helene Roberge,a   Teodor Veres,a   Stephen C. Jakewayb  and  H. John Crabtreeb  

* Corresponding authors

a Industrial Materials Institute: National Research Council Canada, 75 Blvd. De Mortagne, Boucherville, Québec, Canada
E-mail: neil.cameron@cnrc.gc.ca
Fax: +1 (450) 641-5105
Tel: +1 (450) 641-5168

b Micralyne Inc., 1911-94 Street, Edmonton, Alberta, Canada
E-mail: sjakeway@micralyne.com
Fax: +1 (780) 431-4422
Tel: +1 (780) 431-4419

Abstract

We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.

Graphical abstract: High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

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Article information

DOI
https://doi.org/10.1039/B600584E
Article type
Paper
Submitted
17 Jan 2006
Accepted
21 Apr 2006
First published
16 May 2006

Lab Chip, 2006,6, 936-941

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High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction

N. S. Cameron, H. Roberge, T. Veres, S. C. Jakeway and H. John Crabtree, Lab Chip, 2006, 6, 936 DOI: 10.1039/B600584E

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