Issue 15, 2002
From the journal:

Physical Chemistry Chemical Physics

Combining AFM and EQCM for the in situ investigation of surface roughness effects during electrochemical metal depositions

Andreas Bund,*a   Oliver Schneiderb  and  Volker Dehnkec  

* Corresponding authors

a Dresden University of Technology, Institute of Physical Chemistry and Electrochemistry, Mommsenstrasse 13, Dresden, Germany
E-mail: andreas.bund@chemie.tu-dresden.de
Fax: +49 (0)351 463 37164
Tel: +49 (0)351 463 34351

b Clausthal University of Technology, Institute for Metallurgy, Robert-Koch Str. 42, Clausthal-Zellerfeld, Germany

c Clausthal University of Technology, Institute of Physical Chemistry, Arnold-Sommerfeld-Strasse 4, Clausthal-Zellerfeld, Germany

Abstract

In this communication we clearly show that the surface roughness of Cu films strongly influences the signal of an EQCM. These effects were studied with a novel combination of AFM and EQCM, which proved to be a powerful tool for the in situ investigation of surface roughness effects during electrochemical metal depositions and dissolutions.

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Article information

DOI
https://doi.org/10.1039/B204390D
Article type
Communication
Submitted
07 May 2002
Accepted
05 Jun 2002
First published
26 Jun 2002

Phys. Chem. Chem. Phys., 2002,4, 3552-3554

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Combining AFM and EQCM for the in situ investigation of surface roughness effects during electrochemical metal depositions

A. Bund, O. Schneider and V. Dehnke, Phys. Chem. Chem. Phys., 2002, 4, 3552 DOI: 10.1039/B204390D

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