A new procedure for electrodeposition of Co/Cu multilayers by pulse deposition from a single solution is reported. From studies of structure and magnetic properties it has been shown that this method can produce multilayered structures with layer thicknesses as low as 10–15 Å or less and the perpendicular orientation of the magnetization vector promises a possible use in storage devices with vertical recording.
V. M. Fedosyuk, O. I. Kasyutich and N. N. Kozich, J. Mater. Chem., 1991, 1, 795 DOI: 10.1039/JM9910100795
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