Solid state properties of copper containing spinel solid solutions (CuxMg1–xAl2O4)

Abstract

The solid state and surface properties of a series of copper containing spinel solid solutions (Mg_1–xCu_xAl₂O₄) have been studied using X-ray diffraction, magnetic measurements, e.p.r., reflectance spectroscopy, X-ray photoelectron spectroscopy and secondary ion mass spectrometry.

The data indicate that the solutions are homogeneous as between the bulk and the surface. Below x= 0.1 the copper ions mainly occupy octahedral sites and are electronically isolated. Above x= 0.1 half the Cu ions also occupy tetrahedral sites and an increasing degree of electronic delocalisation occurs.