Recent innovations in interfacial strategies for DLP 3D printing process optimization

Abstract

Three-dimensional (3D) printing, also known as additive manufacturing, is capable of transforming computer-aided designs into intricate structures directly and on demand. This technology has garnered significant attention in recent years. Among the various approaches, digital light processing (DLP) 3D printing, which utilizes polymers or prepolymers as the ink, has emerged as the leading new technology, driven by high demand across diverse fields such as customized production, healthcare, education, and art design. DLP 3D printing technology employs cured slices as molding units and is recognized for its potential to achieve both high printing speed and resolution. Recent insights into the DLP printing process highlight its inherent interface transformations between liquid and solid states. This review summarizes key aspects of the printing process, speed, precision, and material diversity optimization, from the view of interfacial interactions between solid and liquid phases which are influenced by resin formation, curing surfaces and light source properties. These interactions include those at the liquid resin–UV pattern interface, the cured structure–curing surface interface, the liquid resin–curing surface interface, and the liquid resin–cured structure interface, each contributing to the unique characteristics of the printed results. Finally, this review addresses the current challenges and limitations of DLP 3D printing, providing valuable insights for future improvements and guiding potential innovations in the field.

Graphical abstract: Recent innovations in interfacial strategies for DLP 3D printing process optimization

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Article information

Article type
Review Article
Submitted
28 Aug 2024
Accepted
15 Oct 2024
First published
18 Oct 2024

Mater. Horiz., 2024, Advance Article

Recent innovations in interfacial strategies for DLP 3D printing process optimization

L. Wu and Y. Song, Mater. Horiz., 2024, Advance Article , DOI: 10.1039/D4MH01160K

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