* Corresponding authors

^a School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
E-mail: xuzc@ntu.edu.sg, elbkong@ntu.edu.sg

^b Singapore Institute of Manufacturing Technologies (SIMTech), 71 Nanyang Drive, Singapore 638075

^c School of Mechanical & Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798

^d Electronic Materials Research Laboratory, School of Electronic and Information Engineering, Xi’an Jiaotong University, Xi’an, P. R. China
E-mail: wxque@xjtu.edu.cn