Heat-controlled micropillar array device for microsystems technology

Abstract

A new temperature-controlled smart soft material micropillar array has been fabricated via in situ integration of the liquid-crystalline elastomer-based component into the hybrid microdevice. Such design allows for developing pushing elements with fast lifetime values of ca. 5 s, and opens huge opportunities for the use of hybrid smart microdevices with total control on the actuation time/response, repeatability, stability and energy saving.