Recent advances and challenges in thermoelectrics toward near-room-temperature and high-temperature applications

Qianhui Lou, Jiayan Gong, Zizheng Zang, Sheng Qian, Yu Liu, Yu Zhang, Yuechu Wang, Shen Han, Chenguang Fu and Tiejun Zhu

Chem. Soc. Rev., 2026, 55, 2265
DOI: 10.1039/D5CS01211B

Enhancing the thermoelectric performance of a Ti2FeNiSb2 double half-Heusler alloy through excess Ni-induced full-Heusler nanoprecipitates

Rahidul Hasan, Yan Gu, Se Yun Kim, Dong Won Chun and Kyu Hyoung Lee

Inorg. Chem. Front., 2023, 10, 5662
DOI: 10.1039/D3QI01132A

Experimental and theoretical determination of the Grüneisen parameter to analyze the density effect on anharmonicity and thermal conductivity in the NbCoSb system

Inder Kumar, Jipin Peter, Anjali Gawande, Gowtham Venkatesan, Praveen Kumar, Satyam Suwas, Raju K. Biswas and Ramesh Chandra Mallik

Phys. Chem. Chem. Phys., 2025, 27, 24872
DOI: 10.1039/D5CP03531G

Strong electron–phonon coupling and high lattice thermal conductivity in half-Heusler thermoelectric materials

Ruoyu Wang, Jianfeng Cai, Qiang Zhang, Xiaojian Tan, Jiehua Wu, Guoqiang Liu and Jun Jiang

Phys. Chem. Chem. Phys., 2024, 26, 8932
DOI: 10.1039/D3CP06160D

Pivotal role of Sb vacancies in quaternary half-Heusler thermoelectrics

Illia Serhiienko, Michael Parzer, Fabian Garmroudi, Andrei Novitskii, Naohito Tsujii, Tarachand, Ernst Bauer, Yuri Grin and Takao Mori

J. Mater. Chem. A, 2025, 13, 15268
DOI: 10.1039/D5TA01437A

Thermoelectric properties of the aliovalent half-Heusler alloy Zn0.5Ti0.5NiSb with intrinsic low thermal conductivity

Blair F. Kennedy, Simon A. J. Kimber, Stefano Checchia, A. K. M. Ashiquzzaman Shawon, Alexandra Zevalkink, Emmanuelle Suard, Jim Buckman and Jan-Willem G. Bos

J. Mater. Chem. A, 2023, 11, 23566
DOI: 10.1039/D3TA04514E

Preparation and thermoelectric properties of Sc-doped Ti_1–xNiSb half-Heusler alloys

Rong-Tao Liu, Chen-Yang Wang, Jia-Mian Huang, Peng-Fei Luo, Xin Liu, Song Ye, Zi-Rui Dong, Ji-Ye Zhang and Jun Luo

Acta Phys. Sin., 2023, 72, 087201
DOI: 10.7498/aps.72.20230035

The single-phase composition and thermoelectric performance of defective half-Heusler Ti1-NiSb prepared by levitation melting

Mengmeng Xiao, Qingying Wang, Yuanjie Qie, Sheng Qian, Shen Han, Chenguang Fu, Teng Fang and Tiejun Zhu

Solid State Sciences, 2025, 168, 108040
DOI: 10.1016/j.solidstatesciences.2025.108040

Strategies to Suppress Thermal Conductivity in Half-Heusler Compounds for Thermoelectric Applications: A Comprehensive Review

Sayan Paul, Supriya Ghosal and Swapan K. Pati

ACS Appl. Energy Mater., 2025, 8, 15585
DOI: 10.1021/acsaem.5c02359

Vacancy‐Filling Heusler Thermoelectric Compounds

Xinyue Zhang, Zirui Dong, Jiye Zhang and Jun Luo

Annalen der Physik, 2025, 537
DOI: 10.1002/andp.202500300

Bonding properties of Rubik's-cube-like Slater-Pauling Heusler semiconductors for thermoelectrics

Zhuoyang Ti, Jianbo Zhu, Shuping Guo, Jingyu Li, Xiaobing Liu and Yongsheng Zhang

Phys. Rev. B, 2023, 108
DOI: 10.1103/PhysRevB.108.195203

Multifunctional Roles of Vacancy Defects in Advancing Thermoelectric Materials

Shuyue Tan, Lifeng Jiang, Huijun Kang, Rongchun Chen, Zongning Chen, Enyu Guo and Tongmin Wang

Small, 2026, 22
DOI: 10.1002/smll.202513437

Collaborative regulation of thermoelectric properties of TiNiSn alloy via melt spinning and excess Ni

Lingfang Liu, Junsong He, Jian Wang, Lijun Zhai, Yan Zhang, Yanli Li, Hongxia Liu and Zhigang Sun

Solid State Sciences, 2026, 176, 108285
DOI: 10.1016/j.solidstatesciences.2026.108285

Magnetically Enhanced Thermoelectric Performance of Ti0.75NiSb+x mol % Fe (x = 0–5) Nanocomposites

Feng Luo, Can Zhu, Jian Wang, Xiong He, Zhen Yang, Shaoqiu Ke, Yan Zhang, Hongxia Liu and Zhigang Sun

ACS Appl. Mater. Interfaces, 2022, 14, 45503
DOI: 10.1021/acsami.2c14450

Design Principles and Experimental Evidence for Semiconducting Heusler Thermoelectrics by Vacancy‐Filling

Yifei Huang, Zirui Dong, Zhiwei Chen, Haojin An, Han Shao, Wen Li, Yixuan Wu and Jun Luo

Small, 2026, 22
DOI: 10.1002/smll.202514323

Effects of magnetic Fe doping on the thermoelectric properties of TiNiSn nanomaterials prepared via melt spinning method

Junsong He, Yicheng Shen, Lijun Zhai, Feng Luo, Yan Zhang, Hongxia Liu, Jifan Hu and Zhigang Sun

Journal of Alloys and Compounds, 2024, 975, 172808
DOI: 10.1016/j.jallcom.2023.172808

Low-Lattice Thermal Conductivity in Zr-Doped Ti2NiCoSnSb Thermoelectric Double Half-Heusler Alloys

Soumya Ranjan Mishra, Li Ping Tan, Vikrant Trivedi, Manjusha Battabyal, P. S. Sankara Rama Krishnan, Durga Venkata Maheswar Repaka, Satyesh Kumar Yadav, Raju Vijayaraghavan Ramanujan and Budaraju Srinivasa Murty

ACS Appl. Energy Mater., 2023, 6, 6262
DOI: 10.1021/acsaem.3c00785

First principle investigation on electronic and thermoelectric properties of CoTiP half-Heusler with Co, Ti, and P vacancies

Abir Bouchrit, Hassan Ahmoum, Jamal EL. Khamkhami, Kamal Assiouan, Hanan Ziani and Achahbar Abdelfettah

Physica B: Condensed Matter, 2024, 674, 415543
DOI: 10.1016/j.physb.2023.415543

MnNiSi Half-Heusler Alloy: Computational and experimental insights for energy harvesting and spintronic applications

Beenaben S S, Radha Sankararajan, Srinivasan Manickam, KlintonBrito K and Prasath M

Chemical Physics Impact, 2025, 10, 100891
DOI: 10.1016/j.chphi.2025.100891

Strategic Design and Mechanistic Understanding of Vacancy‐Filling Heusler Thermoelectric Semiconductors

Weimin Hu, Song Ye, Qizhu Li, Binru Zhao, Masato Hagihala, Zirui Dong, Yubo Zhang, Jiye Zhang, Shuki Torri, Jie Ma, Binghui Ge and Jun Luo

Advanced Science, 2024, 11
DOI: 10.1002/advs.202407578

Simultaneously enhanced thermoelectric properties and mechanical hardness of TiNiSn alloys via Cu-atom doping

Lingfang Liu, Lijun Zhai, Zhongyuan Yang, Lu Gao, Jiangwei Ma, Hongxia Liu and Zhigang Sun

Journal of Alloys and Compounds, 2026, 1050, 185593
DOI: 10.1016/j.jallcom.2025.185593

Balancing the Competing Effects of Carrier and Phonon Transport Mechanisms to Enhance the Thermoelectric Properties of p‐Type Ti2Zr2−xHf2Nb2Fe5.6Ni2.4Sb8 Double Half‐Heusler Alloys via Cation Vacancy Engineering

Chaoyue Wang, Mina Zhang, Longjun He, Shengpan Kan, Ruyan Song, Degang Zhao, Jinghao Li, Daoyong Cong and Xianglin Zhou

Energy & Environ Materials, 2026, 9
DOI: 10.1002/eem2.70170

Enhanced thermoelectric performance of NbCoSb half-Heusler alloys by using an amorphous precursor

Jaeyoung Oh, Ho Seong Lee and Seonghoon Yi

Journal of Non-Crystalline Solids, 2024, 624, 122729
DOI: 10.1016/j.jnoncrysol.2023.122729

Thermoelectric properties of Co doped TiNiCo_xSn alloys fabricated by melt spinning

Jun-Song He, Feng Luo, Jian Wang, Shi-Guan Yang, Li-Jun Zhai, Lin Cheng, Hong-Xia Liu, Yan Zhang, Yan-Li Li, Zhi-Gang Sun and Ji-Fan Hu

Acta Phys. Sin., 2024, 73, 107201
DOI: 10.7498/aps.73.20240112

Stabilization of 19‐Electron Half‐Heuslers: Vacancy Filling as a Pathway Toward Robust Thermoelectric Semiconductors

Xin Liu, Yi Chen, Qizhu Li, Zirui Dong, Binghui Ge, Yubo Zhang, Jiye Zhang and Jun Luo

Small, 2025, 21
DOI: 10.1002/smll.202502068

Discovery of (Sc,V)CoSb double half-Heusler alloys with low lattice thermal conductivity

Xin Liu, Shaoqin Wang, Zirui Dong, Yi Chang, Jiye Zhang, Xinyue Zhang and Jun Luo

Journal of Alloys and Compounds, 2025, 1010, 178078
DOI: 10.1016/j.jallcom.2024.178078

Structure and Thermoelectric Properties of Mg1–xTixNiSb Quaternary Half-Heusler Alloys

Xin Liu, Shaoqin Wang, Yi Chang, Jiutian Liao, Zirui Dong, Jiye Zhang, Xinyue Zhang and Jun Luo

ACS Appl. Energy Mater., 2024, 7, 2285
DOI: 10.1021/acsaem.3c03037

Vacancy-induced pseudogap formation in antiferromagnetic Cr0.86ZnSb

Michael Parzer, Fabian Garmroudi, Herwig Michor, Xinlin Yan, Ernst Bauer, Gerda Rogl, Jiri Bursik, Stephen Cottrell, Raimund Podloucky and Peter Rogl

Phys. Rev. B, 2024, 110
DOI: 10.1103/PhysRevB.110.195124

Selective Scatterings of Phonons and Electrons in Defective Half‐Heusler Nb1−δCoSb for the Figure of Merit zT > 1

Ziheng Gao, Kaiyang Xia, Pengfei Nan, Li Yin, Chaoliang Hu, Airan Li, Shen Han, Min Zhang, Mengzhao Chen, Binghui Ge, Qian Zhang, Chenguang Fu and Tiejun Zhu

Small, 2023, 19
DOI: 10.1002/smll.202302457