This website uses cookies to give you the best user experience. If you continue without changing your settings we'll assume you are happy to receive all RSC cookies. You can change your cookie settings by navigating to our Privacy and Cookies page and following the instructions. These instructions are also obtainable from the privacy link at the bottom of any RSC page.
Lite Version|Standard version
Home > Chemical Communications >
To gain access to this content please
Log in via your home Institution.
Log in with your member or subscriber username and password.
Download


Buy PDF Add PDF to Basket (£42.50*)
*Exclusive of taxes
This article contains 4 page(s)
Abstract | Cited by

We report the preparation of 3D binder-free Si@Ti@TiN thin film array electrodes for supercapacitors using deep silicon etching and magnetron sputtering for the first time. This work not only offers the 3D array structure of Si@Ti@TiN thin films, but also paves a promising way for the construction of high-energy storage systems.

Graphical abstract: Construction of 3D Si@Ti@TiN thin film arrays for aqueous symmetric supercapacitors

Page: ^ Top


Enter Keywords, author, title,reference, or DOI
Log in | Register